The group you’ll be a part of The Customer Support Business Group focuses on enabling our customers with premier customer support throughout their lifecycle with Lam. We drive performance, productivity, safety, and quality of customers installed
Company Description Since its spin-off in September 2025 AUMOVIO continues the business of the former Continental group sector Automotive as an independent company. The technology and electronics company offers a wide-ranging portfolio that makes mobility safe,
Company Description At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: We grow together, we enjoy our work, and
SummaryThe Silicon Engineering team is looking for a motivated intern (m/f/d) in Custom Analog Layout who wants to gain hands-on experience in chip design. You will support our Power Management team in developing analog ICs that
As AI models continue to grow in size and complexity, memory subsystems are emerging as a fundamental bottleneck in modern AI accelerators. The efficiency of future NPU-based systems will increasingly depend on how data is stored,
Integrated Photonics Team Leader Quix Quantum is building the next generation of photonic quantum technologies. We are now looking for an Integrated Photonics Team Leader to drive the development of our photonic hardware platform and lead
What you will do Develop new wafer fab process modules on dry etching tools for GaN HEMT wafers (passivation, metal-etching, plasma clean) Execute process development or integration tasks and build up product and process knowledge Lead
Company Description At AUMOVIO, we own what we do: Developing and producing hardware, software, and services that shape the future of mobility. But what truly sets us apart are our people. People who thrive in our
#WeAreInfor technologies that power the future. Join a team drivingcutting-edge RF-GaN innovation for next-generation RF power applications. As aLead Principal Engineer Device Development RF-GaN (f/m/div), youll combinedeep technical expertise with pioneering development work, shaping advanced devicetechnologies
Welcome! Our Growth is Creating Great Opportunities! Our team is expanding, and we want to hire the most talented people we can. Continued success depends on it! Once youve had a chance to explore our current
AI-for-Chip Design Engineer About imec Germany Imec Heilbronn is a new regional hub pioneering open chiplet architecture that will power the next generation of automotive innovation and AI‑driven systems. Situated at the heart of the Innovation
Wir sind auf der Suche nach großartigen Talenten, die uns beim Aufbau der DNA of tech® unterstützen. Vishay stellt eines der weltweit größten Portfolios an diskreten Halbleitern und passiven elektronischen Bauteilen her, die für innovative Designs
Das Fraunhofer IZM ist ein weltweit führendes Forschungsinstitut auf dem Gebiet des Microelectronic Packaging. Das Center All Silicon System Integration Center Dresden (ASSID) des Fraunhofer IZM mit Standort in Dresden – Moritzburg ist spezialisiert auf den Gebieten Wafer-Level-Packaging, heterogene
Company Description At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: We grow together, we enjoy our work, and
#WeAreIn to create tiny chips and big careers.Are you ready to take the first step in your career? Lets shape the future together! Whether you join as a student, intern, or trainee, youll be part of
#WeAreIn forjobs that impact everyones life. Driving continuous improvement - ready to make quality a culture? As a Principal Engineer Quality Management System,Processes, Methods, Tools (f/m/div) in our Quality & Excellence team uncover the rootcauses behind
Semiconductor Process Development Engineer 慕尼黑 全职 生产 / 制造 / 加工 - 汽车制造 职位描述 1. Conduct literature research and Design of Experiments (DoE) to support the development of SiC semiconductor die attach processes (e.g., sintering, soldering,
For many applications, there is an ongoing need to make use of higher frequencies of the electromagnetic spectrum, which require technological innovations both for development and validation of new products. Therefore, NXP Germany is engaging in
Company Description In September 2025, AUMOVIO emerged as a spin-off from Continental’s former Automotive group sector and has since established itself as an independent technology company. The company offers a broad portfolio for safe, exciting, connected
Company Description In September 2025, AUMOVIO emerged as a spin-off from Continental’s former Automotive group sector and has since established itself as an independent technology company. The company offers a broad portfolio for safe, exciting, connected