Deine Aufgaben Verantwortung für den gesamten Tape-Out-Prozess inklusive Schaltungskoordination, Layout-Integration, DRC-Freigabe, Dokumentation und Release Koordination mehrerer parallel laufender Tape-Out-Projekte Schnittstellenbetreuung zu Foundries und externen Fertigungspartnern Abstimmung von Designs mit Prozessvorgaben und Klärung von Design-Rule-Konflikten Mitwirkung an
For a variety of modern optical systems, reliable characterization and simulation of wave-optical propagation effects is crucial. Depending on the application, this may involve selecting, adapting, or comparing different numerical approaches, ranging from efficient wave-propagation algorithms
Huaweis Kepler Research Center in Jena is responsible for advanced technology research and architectural development of optics-related products. At the Kepler Research Center – Automotive Optics Team we are now looking for a: PhD Student in
TKMS steht für herausragende Ingenieurskunst und Innovationskraft im Überwasser- und Unterwasserschiffbau. Seit mehr als 185 Jahren. Als starker Partner, dem die NATO vertraut, bauen wir 70 Prozent ihrer U-Boot-Flotte und tragen so zu Frieden und Sicherheit
About usWe see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in
Huaweis Heisenberg Research Center in Munich is responsible for advanced technology research, architectural development, design and strategic engineering of our products.Huaweis Kepler Research Center (Jena) is responsible for advanced technology research and architectural development of optics-related
Overview In this role you will lead a high-performing team to push breakthroughs in LCOS-based display and imaging technologies for projector light engines and related optical systems. You will shape next-generation LCOS devices, from concept to
Overview As a Photonics Circuit Designer, you own the schematic, layout, and physical realization of photonic ICs, translating concepts into tape-out-ready blocks. You will collaborate with the Photonics Architect, device and simulation teams, EIC, and packaging