Major Accountabilities Guidance of high speed data interconnect design & optimization in terms of Signal Integrity (SI) and Electromagnetic Compatibility (EMC) in close cooperation with the international and interdisciplinary product development team Analysis and evaluation of
Major AccountabilitiesGuidance of high speed data interconnect design & optimization in terms of Signal Integrity (SI) and Electromagnetic Compatibility (EMC) in close cooperation with the international and interdisciplinary product development teamAnalysis and evaluation of SI/EMC related